Gaya APA

FIDDIN, S, C., IBRAHIM, B. (2008). Perancangan Mold Back Cover Phones Case Di CV. Budi Mulia Mandiri (1st). Bandung: Polman.

Gaya MLA

FIDDIN, Sulthan, Castrena., IBRAHIM, Bustami. "Perancangan Mold Back Cover Phones Case Di CV. Budi Mulia Mandiri". 1st Bandung: Polman, 2008. Printed.