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Failure Analysis: A Practical Guide For Manufacturers of Electronic Components and Systems
Failure analysis is the preferred method to investigate product or process reliability and to ensure optimum performance of electrical components and systems. The physics of failure approach is the only internationally accepted solution for continuously improving the reliability of materials, devices and processes. The models have been developed from the physical and chemical phenomena that area responsible for degradation or failure of electronic components and materials and now replace popular distribution models for failure mechanisms such as Weibull or lognormal.
Reliability engineers need practical orientation around the complex procedures involved in failure analysis. This guide acts as a tool for all advanced techniques, their benefits and vital aspects of their use in a reliability programme. Using twelve complex case studies, the authors explain why failure analysis should be used with electronic components, when implementation is appropriate and methods for its successful use.
Inside you will find detailed coverage on:
- A Synergistic approach to failure modes and
mechanisms, along with reliability physics and
the failure analysis of materials.
- The reasons why failure analysis is an important
tool for improving yield and reliability by
corrective actions.
- The design stage, highlighting the ‘concurrent
engineering’ approach and DfR (Design for Reli-
ability).
- Failure analysis during fabrication, covering
reliability monitoring, process monitors and
package reliability.
- Reliability resting after fabrication, including
reliability assessment at this stage and correct-
ive actions.
- A Large variety of methods, such as electrical,
thermal, optical, electron microscopy, mecha-
nical, X-ray, spectroscopic, acoustical, and
laser methods.
- New challenges in reliability testing, such as
its use in Microsystems and nanostructures.
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