Printed

SMT Soldering Handbook 2nd ed

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Surface Mount Technology has had a profound influence on the electronics industry, and has led to the use of new materials, techniques and manufacturing processes. Since the first edition of this book was written, electronic assemblies have continued to become still smaller and more complex, while soldering still remains the dominant connecting technique. This is a comprehensive guide to the currently used methods of soldering components to their substrates, written by one of the founding fathers of the technology. It also covers component placement, the post CFC technology of cleaning after soldering, and the principles and methods of quality control and rework. New sections deal with Ball Grid Array (BGA) technology, lead free solders, no clean fluxes, and the current standard specifications for solders and fluxes.

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Ketersediaan

Informasi Detail

Judul Seri

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No. Panggil

621.3815 STR s

Penerbit

Oxford : Newnes., 1998

Deskripsi Fisik

xvii, 371 hal. : ilus. ; 23,5 cm

Bahasa

English

ISBN/ISSN

978-0750635899

Klasifikasi

621.381

Tipe Isi

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Tipe Media

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Tipe Pembawa

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Edisi

2

Subjek

Teknik Elektronika

Info Detail Spesifik

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Pernyataan Tanggungjawab

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Versi lain/terkait

Lampiran Berkas

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